[Emerging Memory & Logic Solutions Inc]

FEATURES
- Process Technology : 0.13mm CMOS process
- Organization :1M x16
- Power Supply Voltage : 1.7~1.9V
- Multiplexed address and data bus
- Three state outputs
- RMS and Auto TCSR for power saving

GENERAL WAFER SPECIFICATIONS
- Deep trench process
- 3 Metal layers including local inter-connection
- Typical Pad Size : 73.0um x 70.0um
- Wafer diameter : 8-inch