Features
• ESD / transient protection of high speed data lines exceeding
   – IEC61000-4-2 (ESD): ±25 kV (air / contact)
   – IEC61000-4-4 (EFT): 50 A / ±2.5 kV (5/50 ns)
   – IEC61000-4-5 (Surge): 2.5 A (8/20 µs)
• Maximum working voltage: VRWM = ±5.5 V
• Ultra low capacitance CL = 0.28 pF (typ.) at f = 1 MHz
• Very low clamping voltage: VCL = 20 V (typ.) at ITLP = 16 A according to TLP [1]
• Very low dynamic resistance: RDYN = 0.78 Ω (typ.)
• Minimized overshoot due to extremely low parasitic inductance of chip scale
   package
• Miniature form factor (XY) = 0201 (0.58 mm x 0.28 mm)
• Thin 0.15 mm package thickness to allow direct integration into modules
• Optimized assembly: its bidirectional and symmetric I/V characteristics allow
   placement on the PCB with no danger of polarity orientation issues

APPLICATION Examples
• USB 3.0, Firewire, DVI, HDMI, S-ATA, DisplayPort, Thunderbolt
• Mobile HDMI Link, MDDI, MIPI, SWP / NFC
• Dedicated solution to boost space saving and high performance in miniaturized modern electronics