General Description
Designed on Fairchilds advanced 1.7V PowerTrench® process with state of the art "low pitch" WLCSP packaging process, the FDZ193P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).

FEATUREs
■ Max rDS(on) = 90mΩ at VGS = -4.5V, ID = -1A
■ Max rDS(on) = 130mΩ at VGS = -2.5V, ID = -1A
■ Max rDS(on) = 300mΩ at VGS = -1.7V, ID = -1A
■ Occupies only 1.5 mm2 of PCB area Less than 50% of the area of 2 x 2 BGA
■ Ultra-thin package: less than 0.65 mm height when mounted to PCB
■ RoHS Compliant

APPLICATION
■ Battery management
■ Load switch
■ Battery protection