FS25R12W1T4_B11 Hoja de datos - Infineon Technologies
Número de pieza
FS25R12W1T4_B11
componentes Descripción
Other PDF
PDF
page
9 Pages
File Size
517.9 kB
Fabricante
Infineon Technologies
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• PressFIT Contact Technology
• Rugged mounting due to integrated mounting
clamps
Electrical Features
• Low Switching Losses
• Low VCEsat
• Trench IGBT4
• VCEsat with positive Temperature Coefficient
TypicalApplications
• Air Conditioning
• Motor Drives
• Servo Drives
• UPS Systems
Número de pieza
componentes Descripción
PDF
Fabricante
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC ( Rev : 2009 )
Infineon Technologies
Share Link: