FS3L50R07W2H3F-B11 Hoja de datos - Infineon Technologies
Número de pieza
FS3L50R07W2H3F-B11
componentes Descripción
Other PDF
no available.
PDF
page
14 Pages
File Size
865.3 kB
Fabricante
Infineon Technologies
Electrical Features
• High Speed IGBT H3
• Low Switching Losses
• thinQ!H SiC Schottky diode 650V
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• PressFIT Contact Technology
• Rugged mounting due to integrated mounting clamps
Typical Applications
• 3-Level-Applications
• Motor Drives
• Solar Applications
• UPS Systems
Número de pieza
componentes Descripción
PDF
Fabricante
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT/NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
Share Link: