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EconoPACK™ + module with Trench/Fieldstop IGBT4 and Emitter Controlled 3 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoDUAL™3 module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoDUAL™3 module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™ + module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™4 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoDUAL™3 module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and NTC / pre-applied Thermal Interface Material
Infineon Technologies