1 AMP HIGH RELIABILITY SILICON DIODES

FEATURES
PROPRIETARY SOFT GLASS JUNCTION  PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIP ATION
(Solder V oids: T ypical < 2%, Max. < 10% of Die Area)
EXTREMEL Y LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLT AGE DROP
1A at T = 75 C WITH NO THERMAL RUNAWAY