Features1. Side lead ultra-compact transmission type2. Conforming to solder reflow Pre-heat : 160 ˚C, MAX. 120 sec Reflow : 200 ˚C, MAX. 60 sec 240 ˚C, MAX. 10 sec3. Slit : 0.3 mm4. Gap : 1.6 mm
APPLICATIONs1. CD-ROM drives2. FDDs