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IRFI530G Hoja de datos - Kersemi Electronic Co., Ltd.

IRFI530GPBF image

Número de pieza
IRFI530G

componentes Descripción

Other PDF
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page
7 Pages

File Size
1 MB

Fabricante
KERSEMI
Kersemi Electronic Co., Ltd. KERSEMI

DESCRIPTION
The TO-220 FULLPAK eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The FULLPAK is mounted to a heatsink using a single clip or by a single screw fixing.


FEATURES
• Isolated Package
• High Voltage Isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz)
• Sink to Lead Creepage Distance = 4.8 mm
• 175 °C Operating Temperature
• Dynamic dV/dt Rating
• Low Thermal Resistance
• Lead (Pb)-free Available

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