DESCRIPTION
Third Generation Power HEXFETs form Interantional Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The D-Pak is designed for surface mounting using vapor phase, infrared, or wave solderig techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.

• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR224)
• Straight Lead (IRFU224)
• Available in Tape and Reel
• Fast Switching
• Ease of Paralleling
• Lead-Free