Features
• Silicon Chip on Direct-Copper Bond (DCB) Substrate
• Isolated Mounting Surface
• 3000V Electrical Isolation
• High Blocking Voltage
• International Standard Package
• Low Conduction Losses

Advantages
• Low Gate Drive Requirement
• High Power Density

APPLICATIONs:
• Switched-Mode and Resonant-Mode Power Supplies
• Uninterruptible Power Supplies (UPS)
• Laser Generators
• Capacitor Discharge Circuits
• AC Switches