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LGR971-KO Hoja de datos - Infineon Technologies

LGR971 image

Número de pieza
LGR971-KO

componentes Descripción

Other PDF
  no available.

PDF
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page
6 Pages

File Size
33.1 kB

Fabricante
Infineon
Infineon Technologies Infineon

CHIPLED


FEATUREs
●0805 package
●Industry standard footprint
●low profile
●suitable for IR reflow soldering process
●for use as optical indicator and backlighting
●available taped on reel (8 mm tape)

Page Link's: 1  2  3  4  5  6 

Número de pieza
componentes Descripción
PDF
Fabricante
CHIPLED
Ver
Siemens AG
CHIPLED
Ver
Siemens AG
CHIPLED
Ver
Infineon Technologies
CHIPLED
Ver
Infineon Technologies
CHIPLED
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Siemens AG
Multi CHIPLED
Ver
OSRAM GmbH
Multi CHIPLED ( Rev : 2017 )
Ver
OSRAM GmbH
CHIPLED 0603
Ver
OSRAM GmbH
CHIPLED 0603
Ver
OSRAM GmbH
CHIPLED 0603 ( Rev : 2013 )
Ver
OSRAM GmbH

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