Description
The chip used in the MA4PH611 is manufactured using a unique, CERMACHIP, passivation process which provides for a hard glass encapsulation that protects and hermetically seals the active area of the chip. This packaged, CERMACHIP, PIN diode is ideally suited for use in applications where high RF and DC voltages are present.

FEATUREs
• High Power Handling
• Low Loss / Low Distortion
• Leadless Low Inductance MELF Package
• Surface Mountable
• RoHS Compliant