Description
This device is a PIN diode series-shunt switch element with a unique integrated thermal terminal for dissipating heat in the series diode created by the DC and RF input power. The thermal terminal allows for optimum heat dissipation by providing a direct thermal path from the series diode to circuit thermal ground while also being electrically isolated. The chip is designed to provide a heat transfer conduit that does not interfere with the PIN diode anode (input) and cathode (output) electrical terminals, especially with respect to RF performance. The silicon-glass PIN diode chip is fabricated using M/A-COM Technology Solutions patented HMIC™ process. This device features silicon pedestals embedded in a low loss, low dispersion glass. Selective backside metallization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer to protect against damage during handling and assembly.

FEATUREs
♦ Specified Bandwidth: 30MHz—2.5GHz
♦ Useable to 3.0GHz
♦ Low Loss <0.5dB
♦ High isolation >40dB
♦ High C.W. Incident Power, 50W at 500MHz
♦ Unique Thermal Terminal for Series Diode
♦ Surface Mount Device (No Wire Bonds)
♦ Rugged Silicon-Glass Construction
♦ Silicon Nitride Passivation
♦ Protective Polymer Scratch Protection
♦ RoHS Compliant