MB10S Hoja de datos - Shanghai Leiditech Electronic Technology Co., Ltd
Número de pieza
MB10S
componentes Descripción
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3 Pages
File Size
534.5 kB
Fabricante
Shanghai Leiditech Electronic Technology Co., Ltd
Features
● Low forward voltage drop
● Ideal for automated placement
● Glass Passivated chip junction
● Low profile space
● Low leakage current
● High forward surge capability
● High temperature soldering:
260℃/10 seconds at terminals
● Component in accordance to
RoHS 2011/65/EU and WEEE 2002/96/EC
Número de pieza
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