MB201 Hoja de datos - Microsemi Corporation
Número de pieza
MB201
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2 Pages
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46.7 kB
Fabricante
Microsemi Corporation
FEATURES
• Microminiature package.
• Voidless hermetically sealed glass package.
• Triple layer passivation.
• Metallurgically bonded.
• Ultra fast recovery
• PIV to 215 volts.
• Meet or exceed requirements of MIL-S-19500.
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