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MCWL05GTR27 Hoja de datos - MULTICOMP

MCWL02CTH82N image

Número de pieza
MCWL05GTR27

componentes Descripción

Other PDF
  no available.

PDF
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page
16 Pages

File Size
500.8 kB

Fabricante
MULTICOMP
MULTICOMP MULTICOMP

Scope:
Ceramic body and wire wound construction provide highest SRFs available.


FEATUREs:
• Ceramic base provide high SRF
• Ultra-compact inductors provide high Q factors
• Low profile, high current are available
• Miniature SMD chip inductor for fully automated assembly
• Outstanding endurance from Pull-up force, mechanical shock and pressure
• Tighter tolerance down to ±2%
• Smaller size of 0402 (1005)


APPLICATIONs:
RF Products:
• Cellular Phone (CDMA/GSM/PHS)
• Cordless Phone (DECT/CT1CT2)
• Remote Control, Security System
• Wireless PDA
• WLL, Wireless LAN / Mouse / Keyboard / Earphone
• VCO, RF Module & Other Wireless Products
• Base Station, Repeater
• GPS Receiver

Page Link's: 1  2  3  4  5  6  7  8  9  10  More Pages 

Número de pieza
componentes Descripción
PDF
Fabricante
SMD Wire Wound Chip Inductor
Ver
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Chip Inductor (Chip Coil) Power Inductor (Wire Wound Type)
Ver
Murata Manufacturing
Wire Wound Magnetically Shielded SMD Power Inductor
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Central Technologies
WOUND CHIP POWER INDUCTOR
Ver
Unspecified
Chip Inductor (Chip Coil) for High Frequency Vertical Wire Wound
Ver
Murata Manufacturing
Chip Inductor (Chip Coil) for High Frequency Horizontal Wire Wound
Ver
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SMD Molded Wire Wound Ferrite Chip Inductors
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Frontier Electronics.
Wire-wound Chip Inductors - Open Wound
Ver
Central Technologies

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