FEATURES
• Glass passivated chip junction
• Low forward voltage drop
• Low leakage current, typical IR less than 0.1 μA
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• AEC-Q101 qualified
• Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS
    For use in general purpose rectification of power supplies, inverters, converters, and freewheeling diodes application.