MUR3060G Hoja de datos - Thinki Semiconductor Co., Ltd.
Número de pieza
MUR3060G
componentes Descripción
Other PDF
no available.
PDF
page
2 Pages
File Size
408.9 kB
Fabricante
Thinki Semiconductor Co., Ltd.
Features
◆ Glass passivated chip junction EPI wafer
◆ Ultrafast recovery time for high efficiency
◆ Low reverse leakage current
◆ High surge capacity
Mechanical Data
◆ Case: TO-220AC heatsink
◆ Terminals: Lead solderable per MIL-STD-202, Method 208
◆ Polarity: As marked
◆ Standard packaging: Any
◆ Weight: 2.5 gram approximately
Número de pieza
componentes Descripción
PDF
Fabricante
15.0 Ampere Glass Passivated Chip Ultrafast Recovery Rectifier Diode
Thinki Semiconductor Co., Ltd.
16.0 Ampere Glass Passivated Junction Ultrafast Recovery Rectifiers
Thinki Semiconductor Co., Ltd.
16.0 Ampere Glass Passivated Junction Ultrafast Recovery Rectifiers
Thinki Semiconductor Co., Ltd.
GLASS PASSIVATED JUNCTION ULTRAFAST RECOVERY RECTIFIER ( Rev : 2004 )
PANJIT INTERNATIONAL
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