FEATURES
● LOW PROFILE PACKAGE
● PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0
● IDEAL FOR SURFACE MOUNTED APPLICATION
● GLASS PASSIVATED CHIP JUNCTION
● BUILT-IN STRAIN RELIEF DESIGN
● ULTRA FAST RECOVERY TIME FOR HIGH EFFICIENT
● HIGH TEMPERATURE SOLDERING : 250°C/10 SECONDS AT TERMINALS
● ROHS