MXP1152 Hoja de datos - Microsemi Corporation
Número de pieza
MXP1152
componentes Descripción
Other PDF
no available.
PDF
page
1 Pages
File Size
24.2 kB
Fabricante
Microsemi Corporation
Features
• Small size
• Gold thick film bonding pads
• Custom input and output versions
• Low input current operation
APPLICATIONs
• Solid state relays
• Switching power supplies
• CMOS drivers
• Light meters
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Número de pieza
componentes Descripción
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