Description
• The MXP1156 series consists of a light emmitting source coupled to a dielectrically isolated photovoltaic diode array. This device can be used to drive MOS devices.
• MXP1156H - chip on ceramic substrate for Hybrid applications.
• MXP1156 - standard TO-18 package.

FEATUREs
• Small size for hybrid assembly
• 1,500 Vdc electrical isolation
• Available in package form or ceramic substrate