NEXM Hoja de datos - NIC-Components Corp.
Número de pieza
NEXM
componentes Descripción
Other PDF
no available.
PDF
page
1 Pages
File Size
65.5 kB
Fabricante
NIC-Components Corp.
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS RAM
(UP TO 50μA DISCHARGE CURRENT)
• TAPE AND BOX PACKAGING
• SUITABLE FOR FLOW SOLDERING
• LEAD-FREE FINISH
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