Description:
Each OPB821TX and OP821TXV device consists of a gallium aluminum arsenide LED and a silicon phototransistor, which are soldered into a printed circuit board and mounted in a high temperature plasƟc housing on opposite sides of an 0.080” (2.03 mm) wide slot. Lead wires are #24 AWG polytetraflouroethylene (PTFE) insulated, which conforms to MIL‐W‐ 16878.
Phototransistor switching takes place when an opaque object passes through the slot. For maximum output signal, neither the LED nor the phototransistor is apertured.
TX and TXV device components are processed to OPTEK’s military screening program paƩerned aŌer MIL‐PRF‐19500.

FEATUREs:
• Non-contact switching
• Low profile to facilitate stacking
• Hermetically sealed components
• 24” (609.60 mm) minimum length wire conforms to MIL-W-16878
• TX and TXV components processed to MIL-PRF-19500

APPLICATIONs:
• Non‐contact object sensing
• Assembly line automaƟon
• Machine automaƟon
• Equipment safety
• Machine safety