HIGH SPEED SENSITIVITY

Structure
1.1 Chip Size : 2.00mm X 2.00mm
1.2 Chip thickness : 400±20um
1.3 Metallization : Top - Al, Bottom - Au
1.4 Passivation : Silicon Oxide
1.5 Bonding Pad Size
   - Anode(top) : 170um X 170um
1.6 Active Area : 1.72mm X 1.72mm