FEATURES
◇ Plastic package.
◇ Glass passivated chip junction in DO-15 package.
◇ 600W peak pulse power capability on 10/1000μs waveform.
◇ Excellent clamping capability.
◇ Low zener impedance.
◇ Fast response time: typically less than 1.0ps from 0 volt to BV min.
◇ Typical IR less than 1μA above 10V.
◇ High temperature soldering guaranteed: 265°C/10 seconds/.375”, (9.5mm) lead length, 5lbs., (2.3kg) tension.