FEATURES
• For surface mounted applications in order to optimize board space.
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Typical ID less than 1.0µA above 10V
• Plastic package has Underwriters Laboratory Fammability Classification 94V-O
• High temperature soldering : 260°C /10 seconds at terminals
• In compliance with EU RoHS 2002/95/EC directives