FEATURES
• For surface mounted applications in order to optimize board space.
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Excellent clamping capability
• Low inductance
• Fast response time: typically less than 1.0 ps from 0 volts to BV min
• Typical IR less than 1µA above 10V
• High temperature soldering : 250°C/10 seconds at terminals.
• Plastic package has Underwriters Laboratory Flammability Classification 94V-O