[Intel]

General Device Overview

FEATUREs
General
• Complete Bluetooth 2.1 + EDR solution
    – Configurable for BT 1.2 and 2.0 + EDR
• Ultra low power design in 0.13 μm CMOS
• Temperature range from -40°C to 85°C
• Integrates ARM7TDMI, RAM and patchable ROM
• On-module voltage regulators. External supply 2.9 - 4.1 V
• On-module EEPROM with configuration data
• Reference clock included
• Low power clock from internal oscillator or external low power clock (e.g. 32.768 kHz)
• Dynamic low power mode switching

Interfaces
• 3.25 MBaud UART with transport layer detection (HCI UART, HCI Three-Wire UART)
• PCM/I2S interface for digital audio
• WLAN coexistence interface
• General purpose I/Os with interrupt capabilities. JTAG for boundary scan and debug

RF
• Transmit power programmable from -45 dBm to 4.5 dBm
• Transmit power typ. 2.5 dBm (default settings)
• Receiver sensitivity typ. -86 dBm
• Integrated antenna switch, balun and antenna filter
• Integrated LNA with excellent blocking and intermodulation performance
• No external components except antenna
• Digital demodulation for optimum sensitivity and co-/adjacent channel performance

Bluetooth
• Piconet with seven slaves. Scatternet with two slave roles while still being discoverable
• SCO and eSCO with hardware accelerated audio signal processing
• Audio error correction algorithm (PLC) improving speech quality
• Power control and RSSI. Hold and Sniff.
• Adaptive Frequency Hopping, Quality of Service, Channel Quality Driven Data Rate
• Bluetooth security features: Authentication, Pairing, Encryption and Secure Simple Pairing
• Bluetooth test mode
• Sniff Subrating for lower Sniff power consumption