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PC28F00AM29EWHA Hoja de datos - Microsemi Corporation

JS28F256M29EWHA image

Número de pieza
PC28F00AM29EWHA

componentes Descripción

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page
75 Pages

File Size
849.7 kB

Fabricante
Microsemi
Microsemi Corporation Microsemi

General Description
   The M29EW is an asynchronous, uniform block, parallel NOR Flash memory device manufactured on 65nm multilevel cell (MLC) technology. READ, ERASE, and PROGRAM operations are performed using a single low-voltage supply. Upon power-up, the device defaults to read array mode.


FEATUREs
• 2Gb = stacked device (two 1Gb die)
• Supply voltage
   – VCC = 2.7–3.6V (program, erase, read)
   – VCCQ = 1.65–3.6V (I/O buffers)
• Asynchronous random/page read
   – Page size: 16 words or 32 bytes
   – Page access: 25ns
   – Random access: 100ns (Fortified BGA);
      110ns (TSOP)
• Buffer program: 512-word program buffer
• Program time
   – 0.88µs per byte (1.14 MB/s) TYP when using full
      512-word buffer size in buffer program
• Memory organization
   – Uniform blocks: 128-Kbytes or 64-Kwords each
• Program/erase controller
   – Embedded byte/word program algorithms
• Program/erase suspend and resume capability
   – Read from any block during a PROGRAM SUSPEND operation
   – Read or program another block during an ERASE
      SUSPEND operation
• BLANK CHECK operation to verify an erased block
• Unlock bypass, block erase, chip erase, and write to
   buffer capability
   – Fast buffered/batch programming
   – Fast block/chip erase
• VPP/WP# pin protection
   – Protects first or last block regardless of block
      protection settings
• Software protection
   – Volatile protection
   – Nonvolatile protection
   – Password protection
   – Password access
• Extended memory block
   – 128-word (256-byte) block for permanent, secure
      identification
   – Programmed or locked at the factory or by the
      customer
• Low power consumption: Standby mode
• JESD47H-compliant
   – 100,000 minimum ERASE cycles per block
   – Data retention: 20 years (TYP)
• 65nm multilevel cell (MLC) process technology
• Fortified BGA and TSOP packages
• Green packages available
   – RoHS-compliant
   – Halogen-free
• Operating temperature
   – Ambient: –40°C to +85°C


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