FEATURES
* Batch process design,excellent power dissipation offers
   better reverse leakage current and thermal resistance.
* Low profile surface mounted application in order to
   optimize board space.
* Low power loss,high efficiency.
* High current capability, low forward voltage drop.
* High surge capability.
* Ultra high-speed switching.
* Lead-free parts meet environmental standars of MIL-STD-19500/228
* RoHS product for packing code suffix "G"
   Halogen free product for packing code suffix "H"

MECHANICAL DATA
   Case: Molded plastic, SMA-S
   Epoxy: UL 94V-O rate flame retardant
   Terminals: Solder plated, solderable per
                     MIL-STD-750, Method 2026.
   Mounting position: Any
   Weight: Approximated 0.05 gram.