Features
• Easy paralleling due to the
   positive temperature coefficient of
   the on-state voltage
• Rugged XPT design (Xtreme light
   Punch Through) results in:
      - short circuit rated for 10 µsec.
      - very low gate charge
      - square RBSOA @ 3x IC
      - low EMI
• Thin wafer technology combined
   with the XPT design results in a
   competitive low V
   CE(sat)
• Industry Standard Package
   - solderable pins for PCB
      mounting
   - isolated DCB ceramic base
      plate
• UL release applied

APPLICATIONs
• AC drives
• power supplies with power factor
   correction

Advantages
• Easy to mount with two screws
• Space and weight savings
• Improved  temperature and power
   cycling capability
• High  power density
• Small and light weight