Features:
• The plastic package carries Underwriters Laboratory
   Flammability Classification 94V-0
• For surface mounted applications
• Low reverse leakage
• Super fast switching for high efficiency
• Built-in strain relief, ideal for automated placement
• High forward surge current capability
• High temperature soldering guaranteed:
   250 C/10 seconds at terminals
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

Mechanical Data:
• Case: JEDEC SMA(DO-214AC) molded plastic body
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
• Mounting Position: Any
• Weight:0.002 ounce, 0.07 grams