Features
• For surface mounted applications
• Glass passivated junction Chip
• Low profile package
• Built-in strain relief, ideal for automated placement
• Plastic package has Underwrites Laboratory
   Flammability Classification 94V-0
• High temperature soldering guaranteed: 350℃/10
   seconds, at terminals

Mechanical Data
• Case : JEDEC SMA(DO-214AC) molded plastic body
• Terminals : Plated axial lead solderable per
   MIL-STD-750, method 2026
• Polarity : Color band denotes cathode end
• Mounting Position : Any
• Weight : 0.002 ounce, 0.064 gram