Features:
• Low forward voltage drop
• Low leakage current
• High forward surge capability
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

Mechanical Data:
• Case: JEDEC SMA(DO-214AC) molded plastic body
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes cathode end
• Mounting Position: Any
• Weight:0.07 grams