S1ABF-PJ Hoja de datos - Dongguan Pingjingsemi Technology Co., Ltd,
Número de pieza
S1ABF-PJ
componentes Descripción
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no available.
PDF
page
3 Pages
File Size
474.9 kB
Fabricante
Dongguan Pingjingsemi Technology Co., Ltd,
FEATURES
✦ For surface mount applications
✦ Glass passivated chip junction
✦ Low profile package
✦ Easy to pick and place
✦ Lead free in comply with EU RoHS2011/65/EU directives
MECHANICAL DATA
✦ Case: SMBF molded plastic body
✦ Terminals: Solderable per MIL-STD-750， Method 2026
✦ Weight: Approximated 0.057 grams
Número de pieza
componentes Descripción
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