General description
The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the I2C-bus/SMBus. It is typically mounted on a Dual In-Line Memory Module (DIMM) measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Thermal Sensor Component specification.
The SE98A thermal sensor operates over the VDD range of 1.7 V to 3.6 V. The SE98A does not include the 2 k SPD and is designed for custom DIMM where larger SPD is required.

FEATUREs
◾ JEDEC (JC-42.4) TS3000B1 DIMM ± 0.5 °C (typ.) between 75 °C and 95 °C
   temperature sensor
◾ Optimized for voltage range: 1.7 V to 3.6 V
◾ Shutdown current: 0.1 μA (typ.) and 5.0 μA (max.)
◾ 2-wire interface: I2C-bus/SMBus compatible, 0 Hz to 400 kHz
◾ SMBus ALERT and TIMEOUT (programmable)
◾ 11-bit ADC Temperature-to-Digital converter with 0.125 °C resolution
◾ Operating current: 250 μA (typ.) and 400 μA (max.)
◾ Programmable hysteresis threshold: 0 °C, 1.5 °C, 3 °C, 6 °C
◾ Over/under/critical temperature EVENT output
◾ B grade accuracy:
   ✦ ±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C
   ✦ ±1 °C/±2 °C (typ./max.) → +40 °C to +125 °C
   ✦ ±2 °C/±3 °C (typ./max.) → −40 °C to +125 °C
◾ ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per
   JESD22-A115, and 1000 V CDM per JESD22-C101
◾ Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
◾ Available packages: TSSOP8, HWSON8 (PSON8 VCED-3) and HXSON8

APPLICATIONs
◾ DDR2 and DDR3 memory modules
◾ Laptops, personal computers and servers
◾ Enterprise networking
◾ Hard disk drives and other PC peripherals