Features:
● Schottky Barrier Chip
● Ideally Suited for Automatic Assembly
● Low Power Loss, High Efficiency
● Surge Overload Rating to 50A Peak
● For Use in Low Voltage Application
● Guard Ring Die Construction
● Plastic Case Material has UL Flammability 
● Classification Rating 94F-0
● Green Products in Compliance the ROHS directive
● This is a Pb − Free Device
● All SMC parts are traceable to the wafer lot
● Additional testing can be offered upon request

Mechanical Data
● Case: LoW Profile Molded Plastic
● Terminals: Solder plated, Solderable
   per MIL-STD-750, Method 2026
● Polarity: Cathode Band or Cathode Notch
● Marking: Type Number
● Weight: 0.093 grams (approx.)