FEATURES
♦ Ideally suited for load dump protection
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0
♦ High temperature stability due to unique oxide passivation
♦ Exclusive patented PARª oxide passivated chip construction
♦ Integrally molded heatsink provides a very low thermal resistance for maximum heat dissipation
♦ Low leakage current at TJ=175°C
♦ Low forward voltage drop
♦ High temperature soldering guaranteed: 260°CC for 10 seconds at terminals