Features
• For surface mount application in order to optimize board space
• Low inductance
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Excellent clamping capability
• Repetition Rate( duty cycle): 0.5%
• Fast response time: typical less than 1ps from 0V to BV min
• Typical ID less than 1uA above 10V
• High temperature soldering: 260oC/10 seconds at terminals
• Case Material : Molded Plastic. UL Flammability
   Classification Rating 94V-0
• UL Recognized File E222849

Mechanical Data
• CASE: JEDEC DO-214AB molded plastic body over
   passivated junction
• Terminals: solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes positive end( cathode) except
   Bi-directional types.
• Standard packaging: 16mm tape per ( EIA 481).
• Weight: 0.007 ounce, 0.21 gram