■ FEATURES
● I/O modules for interface between CPU and external input devices or loads
● Ultra slim and light weight, SIL terminals type I/O modules for high density mounting
    —Size: 5 (W) × 20 (L) × 17 (H) mm
    —Weight: approximately 3.0 to 3.5 g
● High isolation by employing photo-coupled devices (between input and output: 2,500 V rms)
● Long life and maintenance free
● All solid state I/O module
● Compatible with NY relay size and terminals arrangement (only output module type)