FEATURES
• Low profile package
• Ideal for automated placement
• Guardring for overvoltage protection
• Low power losses, high efficiency
• Very low forward voltage drop
• High surge capability
• Meets MSL level 1, per J-STD-020C, LF max peak
   of 260 °C
• Solder Dip 260 °C, 40 seconds
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For use in low voltage high frequency inverters, free-wheeling, 
   dc-to-dc converters, and polarity protection
   applications.