FEATURES
• Glass passivated chip junction
• Ultrafast reverse recovery time
• Soft recovery characteristics
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS
  For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.