datasheetbank_Logo
búsqueda de Hoja de datos y gratuito Fichas de descarga
HOME  >>>  Winbond  >>> W25Q256JW PDF

W25Q256JW Hoja de datos - Winbond

W25Q256JW image

Número de pieza
W25Q256JW

Other PDF
  no available.

PDF
DOWNLOAD     

page
95 Pages

File Size
1.6 MB

Fabricante
Winbond
Winbond Winbond

GENERAL DESCRIPTIONS
The W25Q256JW (256M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.7V to 1.95V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages.


FEATURES
• New Family of SpiFlash Memories
   – W25Q256JW: 256M-bit / 32M-byte
   – Standard SPI: CLK, /CS, DI, DO
   – Dual SPI: CLK, /CS, IO0, IO1
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – 3 or 4-Byte Addressing Mode
   – Software & Hardware Reset
• Highest Performance Serial Flash
   – 133MHz Standard/Dual/Quad SPI clocks
   – 266/532MHz equivalent Dual/Quad SPI
   – 66MB/S continuous data transfer rate
   –Min. 100K Program-Erase cycles per sector
   – More than 20-year data retention
• Low Power, Wide Temperature Range
   – Single 1.7V to 1.95V supply
   –<1µA Power-down (typ.)
   – -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
   – Uniform Sector/Block Erase (4K/32K/64K-Byte)
   – Program 1 to 256 byte per programmable page
   – Erase/Program Suspend & Resume
• Advanced Security Features
   – Software and Hardware Write-Protect
   – Power Supply Lock-Down
   – Special OTP protection
   – Top/Bottom, Complement array protection
   – Individual Block/Sector array protection
   – 64-Bit Unique ID for each device
   – Discoverable Parameters (SFDP) Register
   – 3X256-Bytes Security Registers with OTP locks
   – Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging
   – 8-pad WSON 6x5-mm / 8x6-mm
   – 16-pin SOIC 300-mil (additional /RESET pin)
   – 24-ball TFBGA 8x6-mm
   – 32-ball WLCSP
   – Contact Winbond for KGD and other options


Share Link: GO URL

EnglishEnglish Korean한국어 Chinese简体中文 Japanese日本語 Russianрусский

All Rights Reserved© datasheetbank.com  [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]