FEATURES
■ Access Times of 70, 90, 120ns
■ Packaging:
    • 66 pin, PGA Type, 1.185” square, Hermetic Ceramic HIP (Package 401)
    • 68 lead, 22mm Low Profi le CQFP, 4.6mm (0.180”), (Package 509)
■ Sector Architecture
    • One 16KByte Sectors
    • Two 8KByte Sectors
    • One 32KByte Sectors
    • Fifteen 64KByte Sectors
■ 1,000,000 Erase/Program Cycles
■ Organized as 1Mx32, user confi gurable as 2Mx16 or 4Mx8.
■ Commercial, Industrial and Military Temperature Ranges
■ 5V ± 10% for Read and Write Operations.
■ Low Power CMOS
■ Embedded Erase and Program Algorithm
■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
■ Weight
    WEDF1M32B-XG2TX5 - 8 grams typical
    WEDF1M32B-XHX5 - 13 grams typical