FEATURES
◾ Access Times 15, 17, 20, 25, 35, 45, 55ns
◾ MIL-STD-883 Compliant Devices Available
◾ Revolutionary, Center Power/Ground Pinout JEDEC
   Approved
   • 36 lead Ceramic SOJ (Package 100)
   • 36 lead Ceramic Flat Pack (Package 226)
◾ Evolutionary, Corner Power/Ground Pinout JEDEC
   Approved
   • 32 pin Ceramic DIP (Package 300)
   • 32 lead Ceramic SOJ (Package 101)
   • 32 lead Ceramic Thinpack™ Flat Pack (Package 321)
   • 32 pin, Rectangular Ceramic Leadless Chip Carrier
      (Package 601)
   • Commercial, Industrial and Military Temperature Range
   • 5V Power Supply
   • Low Power CMOS
   • Low Power Data Retention for Battery Back-up Operation
   • TTL Compatible Inputs and Outputs