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SC18IS600 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Lista de partido
SC18IS600
NXP
NXP Semiconductors. NXP
SC18IS600 Datasheet PDF : 30 Pages
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NXP Semiconductors
SC18IS600
SPI to I2C-bus interface
3. Ordering information
Table 1. Ordering information
Type number
Topside
marking
SC18IS600IPW
18IS600
SC18IS600IPW/S8 18IS600
SC18IS600IBS
600
Package
Name
Description
TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
HVQFN24 plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4 4 0.85 mm
Version
SOT403-1
SOT403-1
SOT616-3
3.1 Ordering options
Table 2. Ordering options
Type number
Orderable part number
SC18IS600IPW
SC18IS600IPW,112[1]
SC18IS600IPW,128[1]
SC18IS600IPW/S8 SC18IS600IPW/S8HP[2][3]
SC18IS600IBS
SC18IS600IBS,128[1]
SC18IS600IBS,151[1]
SC18IS600IBS,157[1]
Package Packing method
TSSOP16 STANDARD
MARKING * IC'S
TUBE - DSC BULK
PACK
TSSOP16 REEL 13" Q2/T3
*STANDARD MARK
SMD
TSSOP16 REEL 13" Q2/T3
*STANDARD MARK
SMD
HVQFN24 REEL 13" Q2/T3
*STANDARD MARK
SMD
HVQFN24 STANDARD
MARKING * TRAY
PACK, BAKEABLE,
SINGLE
HVQFN24 STANDARD
MARKING * TRAY
PACK, BAKEABLE,
MULTIPLE
Minimum Temperature
order
quantity
2400
Tamb = 40 C to +85 C
2500
Tamb = 40 C to +85 C
2500
Tamb = 40 C to +85 C
1500
Tamb = 40 C to +85 C
490
Tamb = 40 C to +85 C
2450
Tamb = 40 C to +85 C
[1] Discontinued 201706009DN with Last Time Buy 12/7/2018 and Last Time Ship 6/6/2019.
[2] NXP plans to supply the /S8 device which is identical to the discontinued device for a minimum of 7 years with an expected
discontinuation in the 2024-2025 timeframe, but in the meantime, Failure Analysis for /S8 devices will consist of Automated Test
Equipment (ATE) and electrical overstress verification along with package and wire bond validation only. Detailed device failure analysis
will not be available; refer to CIN 201708035I.
[3] The “,128” packing code for tape and reel with pin 1 in Q2 is now “HP”.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 20 November 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
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