NXP Semiconductors
5.3
1.475
5.05
1.475
1.5
(4×)
0.45
(2×)
1.45
(6×)
2.85
Fig. 10. Wave soldering footprint for TSOP6 (SOT457)
BAS21AVD
High-voltage switching diodes
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot457_fw
BAS21AVD
Product data sheet
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1 August 2013
© NXP N.V. 2013. All rights reserved
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