radiate noise into the circuit, and lead to device
over-voltage stress. Careful component selection
and tight layout of critical components, and short,
wide metal trace minimize the voltage spike.
A ground plane should be used. Locate the input
capacitors (CIN) close to the power switches.
Minimize the loop formed by CIN, the upper
MOSFET (Q1) and the lower MOSFET (Q2) as
possible. Connections should be as wide as short
as possible to minimize loop inductance.
The connection between Q1, Q2 and output induc-
tor should be as wide as short as practical. Since
this connection has fast voltage transitions will ea-
sily induce EMI.
The output capacitor (COUT) should be located as
close the load as possible. Because minimize the
transient load magnitude for high slew rate requires
low inductance and resistance in circuit board
AIC1574
The AIC1574 is best placed over a quiet ground
plane area. The GND pin should be connected to
the groundside of the output capacitors. Under no
circumstances should GND be returned to a ground
inside the CIN, Q1, Q2 loop. The GND and PGND
pins should be shorted right at the IC. This help to
minimize internal ground disturbances in the IC and
prevents differences in ground potential from dis-
rupting internal circuit operation.
The wiring traces from the control IC to the MOS-
FET gate and source should be sized to carry peak
current.
The Vcc pin should be decoupled directly to GND
by a 2.2µF ceramic capacitor, trace lengths should
be as short as possible.
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