MC74VHC244 Ver la hoja de datos (PDF) - ON Semiconductor
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MC74VHC244 Datasheet PDF : 8 Pages
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MC74VHC244
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
VIN
VOUT
TA
tr, tf
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range, all Package Types
Input Rise or Fall Time
Min
2.0
0
0
−55
VCC = 3.3 V + 0.3 V
0
VCC = 5.0 V + 0.5 V
Max
5.5
5.5
VCC
125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 2. Failure Rate vs. Time Junction Temperature
DC CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
VCC
Condition
(V)
VIH
Minimum High−Level
Input Voltage
2.0
3.0 to
5.5
VIL
Maximum Low−Level
Input Voltage
2.0
3.0 to
5.5
VOH
Maximum High−Level VIN = VIH or VIL
2.0
Output Voltage
IOH = −50 mA
3.0
4.5
VIN = VIH or VIL
IOH = −4 mA
3.0
IOH = −8 mA
4.5
VOL
Maximum Low−Level VIN = VIH or VIL
2.0
Output Voltage
IOL = 50 mA
3.0
4.5
VIN = VIH or VIL
IOH = 4 mA
3.0
IOH = 8 mA
4.5
IIN
Input Leakage Current VIN = 5.5 V or GND
0 to
5.5
IOZ
Maximum 3−State
VIN = VIH or VIL
5.5
Leakage Current
VOUT = VCC or GND
ICC
Maximum Quiescent VIN = VCC or GND
5.5
Supply Current
(per package)
TA = 25°C
Min Typ Max
1.5
VCCX
0.7
0.5
VCCX
0.3
1.9 2.0
2.9 3.0
4.4 4.5
2.58
3.94
0.0 0.1
0.0 0.1
0.0 0.1
0.36
0.36
±0.1
±0.25
4.0
TA ≤ 85°C
Min Max
1.5
VCCX
0.7
1.5
VCCX
0.7
0.5
VCCX
0.3
1.9
2.9
4.4
2.48
3.8
0.1
0.1
0.1
0.44
0.44
±1.0
±2.5
40.0
−55°C ≤ TA ≤ 125°C
Min
Max Unit
1.5
V
VCCX
0.7
0.5
V
VCCX
0.3
1.9
V
2.9
4.4
2.34
3.66
0.1
V
0.1
0.1
0.52
0.52
±1.0 mA
±2.5 mA
40.0 mA
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